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 0003A SERIES
High speed switching Silicon N-channel MOSFET
DESCRIPTION
INK0003AX is a Silicon N-channel MOSFET. This product is most suitable for low voltage use such as portable machinery , because of low voltage drive and low on resistance.
OUTLINE DRAWING
INK0003AT2 INK0003AM1
2.1 0.2 0.8 0.2 0.425 1.25
Unitmm
0.425
0.25
0.4
FEATURE
Input impedance is high, and not necessary to consider a drive electric current. Vth is low, and drive by low voltage is possible. Vth=0.61.2V Low on Resistance. Ron=0.9(TYP) High speed switching. Small package for easy mounting.
1.2 0.8
0.65


2.0 1.3
0.4
0.9
0.65
0.7
APPLICATION
high speed switching , Analog switching JEITA, JEDEC ISAHAYAT-USM TERMINAL CONNECTOR GATE SOURCE DRAIN INK0003AU1
1.6
JEITASC-70 JEDEC TERMINAL CONNECTOR GATE SOURCE DRAIN INK0003AC1
2.5 0.4 0.5 1.5 0.5
EQUIVALENT CIRCUIT
D
0.4
0.8
0.3
00.1
0.15 00.1 0.16 0.4
0.5

1.6 1.0
S
0.7
0.55
0.15
1.1
JEITASC-75A JEDEC TERMINAL CONNECTOR GATE SOURCE DRAIN
00.1
JEITASC-59 JEDECSimilar to TO-236 T TERMINAL CONNECTOR GATE SOURCE DRAIN
ISAHAYA ELECTRONICS CORPORATION
0.8
0.95
G
0.5
2.9 1.90
0.95
0.5
0.3
0003A SERIES
High speed switching Silicon N-channel MOSFET
MAXIMUM RATING
SYMBOL DSS GSS D ch PARAMETER Drain-source voltage Gate-source voltage Drain current Total power dissipation Ta=25 Channel temperature Range of Storage temperature INK0003AT2 RATING INK0003AU1 INK0003AM1 20 8 200 150 +150 -55+150 200 INK0003AC1 UNIT V V mA mW
125 +125 -55+125
ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER Drain-source breakdown voltage Gate-source leak current Zero gate voltage drain current Gate threshold voltage Forward transfer admittance Static drain-source on-state resistance Input capacitance Output capacitance Switching time
package mounted on 9mmx19mmx1mm glass-epoxy substrate.
TEST CONDITION I D=100A, V V V V
GS DS GS
V(BR)DSS IGSS IDSS Vth | Yfs | RDS(ON) Ciss Coss tON tOFF
=0V
MIN 20 0.6 -
LIMIT TYP 300 0.9 34 8.5 14 85
MAX 0.5 1.0 1.2 -
UNIT V A A V mS pF pF ns
=5V, VDS=0V
DS= V
=20V ,VGS=0V
GS
I D=250A, V
DS
=10V, I D=0.1A
GS
I D=100mA, V V V V V
DS
=4.0V
=10V, V
GS
=0V,f=1MHz
DS=10V, V DD GS
GS=0V,f=1MHz
=5V , I D = 10mA =05V
Switching time test condition
test circuit
5V IN
OUT
5V
90%
RL 0 10s VDD=5V D.U.1% Common source Ta=25 50 VDD
input waveform
0V VDD
10%
10%
output waveform
VDS(ON
ton
90%
tr toff tf
ISAHAYA ELECTRONICS CORPORATION
TYPICAL CHARACTERISTICS
Ta=25 100
1.6V 1.5V 1.4V
ID -VDS Ta=25 1
1.0V
ID -VDS(Low voltage region)
80 Drain current ID (mA) Drain current ID (mA)
0.8
60
1.3V
0.6
0.95V
40
1.2V
0.4
0.9V
20
1.1V VGS=1.0V
0.2
0.85V VGS=0.8V
0 0 2 4 6 Drain-Source voltage VDS (V)
0 10 0 0.1 0.2 0.3 Drain-Source voltage VDS (V)
8
0.4
0.5
IDR -VDS 100 Drain reverse current IDR (mA) Ta=25 VGS=0V Drain current ID (mA) 100 1000 Ta=25 VDS=10V
ID -VGS
10
10
1 -0 -0.5 -1 -1.5 -2 Drain-Source voltage VDS (V)
1 0 1 2 3 4 5 Gate-Source voltage VGS (V)
|Yfs| - ID 1000 Forward transfer admittance |Yfs| (mS) Ta=25 VDS=10V Drain-Source ON voltage VDS(ON) (mV) 100 100 1000 Ta=25 VGS=4V
VDS(ON) -ID
10
10
1
1 1 10 100 1000 Drain current ID (mA)
0.1 1 10 Drain currentID (mA) 100
t - ID 10000 Ta=25 toff Switching time t (ns) Capacitance C (pF) 1000 100
C - VDS
Ciss t
100
10 Coss
10
ton tr
Ta=25 VGS=0V 1 0.1 1 10 100
1 0.1 1 10 100 Drain current ID (mA)
Drain-Source voltage VDS (V)
ISAHAYA ELECTRONICS CORPORATION
Marketing division, Marketing planning department
6-41 Tsukuba, Isahaya, Nagasaki, 854-0065 Japan
Keep safety first in your circuit designs! *ISAHAYA Electronics Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (1) placement of substitutive, auxiliary, (2) use of non-farmable material or (3) prevention against any malfunction or mishap. Notes regarding these materials *These materials are intended as a reference to our customers in the selection of the ISAHAYA products best suited to the customer's application; they don't convey any license under any intellectual property rights, or any other rights, belonging ISAHAYA or third party. *ISAHAYA Electronics Corporation assumes no responsibility for any damage, or infringement of any third party's rights , originating in the use of any product data, diagrams, charts or circuit application examples contained in these materials. *All information contained in these materials, including product data, diagrams and charts, represent information on products at the time of publication of these materials, and are subject to change by ISAHAYA Electronics Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact ISAHAYA Electronics Corporation or an authorized ISAHAYA products distributor for the latest product information before purchasing product listed herein. *ISAHAYA Electronics Corporation products are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact ISAHAYA electronics corporation or an authorized ISAHAYA products distributor when considering the use of a product contained herein for any specific purposes , such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. *The prior written approval of ISAHAYA Electronics Corporation is necessary to reprint or reproduce in whole or in part these materials. *If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to t e export control laws and regulations of Japan and/or the country of destination is h prohibited. *Please contact ISAHAYA Electronics Corporation or authorized ISAHAYA products distributor for further details on these materials or the products contained therein.
Oct.2008


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